설명
Single Loader with FOUP opener (Right/Wide) Standard Hot chuck, Ni (50C-150C) Flip SACC WAPP Insight OCR 1700 VIP4 CPU RS232 GPIB I/F Combo 350환경 설정
환경 설정 없음OEM 모델 설명
The P-12XLn+ is a next-generation wafer prober developed for 300mm testing. It retains the acclaimed on-axis alignment feature of previous models while being able to handle reduced pad sizes. The system assures high-accuracy probing under both high and low temperature conditions, thanks to its hot and cold temperature, heat dissipation thermal systems. Additionally, the P-12XLn+'s rigid deflection-resistant stage can handle higher pin counts with lower mechanical deflection. The P-12XLn+ also features an automation system and equipment standardization, as well as clean technology, PC-aided product file management, and remote operation. It is capable of handling CIM/FA, such as AMHS, and is software compatible with the P-8 series probers. The P-12XLn+ is capable of measuring wafer sizes of 300mm, 200mm, and 150mm (option). TEL has also introduced the P12XLm, an improved model of the P-12XLn+, with superior alignment capability.문서
문서 없음
카테고리
Probers
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
106110
웨이퍼 사이즈:
8"/200mm, 12"/300mm
빈티지:
2008
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
TEL / TOKYO ELECTRON
P-12XLn+
카테고리
Probers
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
106110
웨이퍼 사이즈:
8"/200mm, 12"/300mm
빈티지:
2008
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Single Loader with FOUP opener (Right/Wide) Standard Hot chuck, Ni (50C-150C) Flip SACC WAPP Insight OCR 1700 VIP4 CPU RS232 GPIB I/F Combo 350환경 설정
환경 설정 없음OEM 모델 설명
The P-12XLn+ is a next-generation wafer prober developed for 300mm testing. It retains the acclaimed on-axis alignment feature of previous models while being able to handle reduced pad sizes. The system assures high-accuracy probing under both high and low temperature conditions, thanks to its hot and cold temperature, heat dissipation thermal systems. Additionally, the P-12XLn+'s rigid deflection-resistant stage can handle higher pin counts with lower mechanical deflection. The P-12XLn+ also features an automation system and equipment standardization, as well as clean technology, PC-aided product file management, and remote operation. It is capable of handling CIM/FA, such as AMHS, and is software compatible with the P-8 series probers. The P-12XLn+ is capable of measuring wafer sizes of 300mm, 200mm, and 150mm (option). TEL has also introduced the P12XLm, an improved model of the P-12XLn+, with superior alignment capability.문서
문서 없음