설명
설명 없음환경 설정
- Precio standard application software (PSAS) - Auto alignment system (needle tip, wafer) - Bi-temp (room and hot chuck) - Semi Automatic Probe Card Changer option - Chuck camera Unite II - Bridge camera Unit II - Alarm monitor - Real time wafer map disp - Single opener loader - 480sq headplate frame - 440mm base headplate adapter (no interface) - Hot chuck (50C-150C) - GPIB I/F (w/cable 4m) - STD WAPP - Peral brush - LCD panel standard - LAN network kit - Touch pen - Top side OCROEM 모델 설명
The Precio™ series is a fully automatic wafer-probing platform designed to meet the increasing demand for probing technology in the test process. With process miniaturization, higher device functionality, and package variety, the Precio™ series offers reliable solutions to a wide range of probing demands. It has a wafer size of 200/300mm and uses ball screw stage technology. The XY probing accuracy is ±1.8μm, and the Z probing accuracy is ±5.0μm, allowing for more reliable contacts and greater Z-axis control for soft contact. The probing force is 200/300kg (available as an option). The optical system used is ASU/BCU-Ⅱ, and the operation system is Windows+VME. Optimum temperature control during testing and increased parallel die testing are also achieved with the Precio™ prober series.문서
문서 없음
TEL / TOKYO ELECTRON
PRECIO
검증됨
카테고리
Probers
마지막 검증일: 27일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
103558
웨이퍼 사이즈:
알 수 없음
빈티지:
2014
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
TEL / TOKYO ELECTRON
PRECIO
카테고리
Probers
마지막 검증일: 27일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
103558
웨이퍼 사이즈:
알 수 없음
빈티지:
2014
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
- Precio standard application software (PSAS) - Auto alignment system (needle tip, wafer) - Bi-temp (room and hot chuck) - Semi Automatic Probe Card Changer option - Chuck camera Unite II - Bridge camera Unit II - Alarm monitor - Real time wafer map disp - Single opener loader - 480sq headplate frame - 440mm base headplate adapter (no interface) - Hot chuck (50C-150C) - GPIB I/F (w/cable 4m) - STD WAPP - Peral brush - LCD panel standard - LAN network kit - Touch pen - Top side OCROEM 모델 설명
The Precio™ series is a fully automatic wafer-probing platform designed to meet the increasing demand for probing technology in the test process. With process miniaturization, higher device functionality, and package variety, the Precio™ series offers reliable solutions to a wide range of probing demands. It has a wafer size of 200/300mm and uses ball screw stage technology. The XY probing accuracy is ±1.8μm, and the Z probing accuracy is ±5.0μm, allowing for more reliable contacts and greater Z-axis control for soft contact. The probing force is 200/300kg (available as an option). The optical system used is ASU/BCU-Ⅱ, and the operation system is Windows+VME. Optimum temperature control during testing and increased parallel die testing are also achieved with the Precio™ prober series.문서
문서 없음