설명
No Hard Drive included. May need TEL or third-party support for OS and software installation. Prior owner’s internal policy is to remove hard drives from all their resale equipment before releasing.환경 설정
Dual FOUP Interface Wafer size (mm): 200, 300 Stage technology: Linear motor No Hinge Manipulator Temperature Control System SACC FOUP Auto Loader Floppy Disk Drive GP-IB interface Combo Interface Cold Chuck -55C to 150C Chiller TEL model C325, down to -25d C Semi automatic Probe card changerOEM 모델 설명
The Precio™ series is a fully automatic wafer-probing platform designed to meet the increasing demand for probing technology in the test process. With process miniaturization, higher device functionality, and package variety, the Precio™ series offers reliable solutions to a wide range of probing demands. It has a wafer size of 200/300mm and uses ball screw stage technology. The XY probing accuracy is ±1.8μm, and the Z probing accuracy is ±5.0μm, allowing for more reliable contacts and greater Z-axis control for soft contact. The probing force is 200/300kg (available as an option). The optical system used is ASU/BCU-Ⅱ, and the operation system is Windows+VME. Optimum temperature control during testing and increased parallel die testing are also achieved with the Precio™ prober series.문서
문서 없음
카테고리
Probers
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Deinstalled
제품 ID:
112499
웨이퍼 사이즈:
8"/200mm, 12"/300mm
빈티지:
2018
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
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TEL / TOKYO ELECTRON
PRECIO
카테고리
Probers
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Deinstalled
제품 ID:
112499
웨이퍼 사이즈:
8"/200mm, 12"/300mm
빈티지:
2018
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
No Hard Drive included. May need TEL or third-party support for OS and software installation. Prior owner’s internal policy is to remove hard drives from all their resale equipment before releasing.환경 설정
Dual FOUP Interface Wafer size (mm): 200, 300 Stage technology: Linear motor No Hinge Manipulator Temperature Control System SACC FOUP Auto Loader Floppy Disk Drive GP-IB interface Combo Interface Cold Chuck -55C to 150C Chiller TEL model C325, down to -25d C Semi automatic Probe card changerOEM 모델 설명
The Precio™ series is a fully automatic wafer-probing platform designed to meet the increasing demand for probing technology in the test process. With process miniaturization, higher device functionality, and package variety, the Precio™ series offers reliable solutions to a wide range of probing demands. It has a wafer size of 200/300mm and uses ball screw stage technology. The XY probing accuracy is ±1.8μm, and the Z probing accuracy is ±5.0μm, allowing for more reliable contacts and greater Z-axis control for soft contact. The probing force is 200/300kg (available as an option). The optical system used is ASU/BCU-Ⅱ, and the operation system is Windows+VME. Optimum temperature control during testing and increased parallel die testing are also achieved with the Precio™ prober series.문서
문서 없음