설명
Missing Parts: Mg Rotation Assembly, DC Cable, RF Cable, ESC, Sputter DC Power Supply, Dry Pump, BEC Terminal, Mg Motor, Magnet, Lift Cylinder Set, Matching Box,RF power supply, turbo controller환경 설정
Sputter ETCH × 2 channels, SIP-Ti × 3 channelsOEM 모델 설명
Applied Materials, Inc.SL has been introduced, a new generation of Applied Materials, Inc.PVD (physical vapor deposition) platform. The new platform features high throughput and productivity in several PVD applications and expands the family of products to provide customers with a complete offering of PVD solutions. The system, which is available with several PVD aluminum and barrier layer process chambers, uses two dual-blade robots for faster wafer handling and higher transfer speeds. The system's new loadlock module accommodates the degas and cooldown chambers, enabling up to six process chamber positions on the platform for maximum system capacity and overall throughput. The system is designed to conform to the latest communications and facility standards, and is available with factory automation capability.문서
문서 없음
카테고리
PVD / Sputtering
마지막 검증일: 14일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
143506
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
ENDURA SL PVD
카테고리
PVD / Sputtering
마지막 검증일: 14일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
143506
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Missing Parts: Mg Rotation Assembly, DC Cable, RF Cable, ESC, Sputter DC Power Supply, Dry Pump, BEC Terminal, Mg Motor, Magnet, Lift Cylinder Set, Matching Box,RF power supply, turbo controller환경 설정
Sputter ETCH × 2 channels, SIP-Ti × 3 channelsOEM 모델 설명
Applied Materials, Inc.SL has been introduced, a new generation of Applied Materials, Inc.PVD (physical vapor deposition) platform. The new platform features high throughput and productivity in several PVD applications and expands the family of products to provide customers with a complete offering of PVD solutions. The system, which is available with several PVD aluminum and barrier layer process chambers, uses two dual-blade robots for faster wafer handling and higher transfer speeds. The system's new loadlock module accommodates the degas and cooldown chambers, enabling up to six process chamber positions on the platform for maximum system capacity and overall throughput. The system is designed to conform to the latest communications and facility standards, and is available with factory automation capability.문서
문서 없음