설명
UBM DEP환경 설정
환경 설정 없음OEM 모델 설명
The industry proven CLUSTERLINE® 300 is a flexible cluster platform allowing easy tool configuration with single process modules or unique batch sputter module technology. System Highlights Choose CLUSTERLINE® 300 for Wafer Level Packaging, Backside Metallization / Thin Wafer Processing and selected applications in Optoelectronics. -Integration of single process modules for PVD, highly ionized PVD, and Soft Etch -Thin wafer handling capability down to 300 μm and wafer bow up to 4mm; -200/300mm bridge or split tool compliant -New Degas and Artic dome etch technology for handling strongly outgassing organic substrates in WLP applications -Load Port Modules with 300mm FOUP load ports or open cassettes for 200mm -Wafer aligner for rotational pre-alignment (0.3°) and centering of wafers (0.05mm)문서
문서 없음
카테고리
PVD / Sputtering
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
127983
웨이퍼 사이즈:
12"/300mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVATEC / UNAXIS / OERLIKON / BALZERS
CLUSTERLINE 300
카테고리
PVD / Sputtering
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
127983
웨이퍼 사이즈:
12"/300mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
UBM DEP환경 설정
환경 설정 없음OEM 모델 설명
The industry proven CLUSTERLINE® 300 is a flexible cluster platform allowing easy tool configuration with single process modules or unique batch sputter module technology. System Highlights Choose CLUSTERLINE® 300 for Wafer Level Packaging, Backside Metallization / Thin Wafer Processing and selected applications in Optoelectronics. -Integration of single process modules for PVD, highly ionized PVD, and Soft Etch -Thin wafer handling capability down to 300 μm and wafer bow up to 4mm; -200/300mm bridge or split tool compliant -New Degas and Artic dome etch technology for handling strongly outgassing organic substrates in WLP applications -Load Port Modules with 300mm FOUP load ports or open cassettes for 200mm -Wafer aligner for rotational pre-alignment (0.3°) and centering of wafers (0.05mm)문서
문서 없음