설명
설명 없음환경 설정
-Software Version 5.65B38_1.80B27 -CIM E84, SECS/GEM, GEM300, INTERFACE A -Process TFM_TiN-HM Dep -Main System Novellus_TiNMetalDepOEM 모델 설명
The INOVA NExT, a 300mm metallization system designed to deposit highly conformal copper barrier-seed films at 45 nanometers and beyond. On the INOVA NExT, the single target HCM technology has been extended to the 45 nanometer node; the system also features an integrated ion-induced atomic layer deposition (iALD) module to deposit tantalum nitride (TaN) barrier films below 45 nanometers.문서
문서 없음
LAM RESEARCH / NOVELLUS
INOVA NExT
검증됨
카테고리
PVD / Sputtering
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
106057
웨이퍼 사이즈:
12"/300mm
빈티지:
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH / NOVELLUS
INOVA NExT
카테고리
PVD / Sputtering
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
106057
웨이퍼 사이즈:
12"/300mm
빈티지:
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
-Software Version 5.65B38_1.80B27 -CIM E84, SECS/GEM, GEM300, INTERFACE A -Process TFM_TiN-HM Dep -Main System Novellus_TiNMetalDepOEM 모델 설명
The INOVA NExT, a 300mm metallization system designed to deposit highly conformal copper barrier-seed films at 45 nanometers and beyond. On the INOVA NExT, the single target HCM technology has been extended to the 45 nanometer node; the system also features an integrated ion-induced atomic layer deposition (iALD) module to deposit tantalum nitride (TaN) barrier films below 45 nanometers.문서
문서 없음