설명
설명 없음환경 설정
-Cryo pump on chamber -Load lock turbo, QDP-80 dry pump -2 ch. Auto gas control -2kw RF / 5KW DC -Comes with 4 RF diode / 8 in round targets (2 silicon) -Chamber heat option - digital target & substrate bias meters -RF deposition, etch mode, bias mode, and split power. (T1 & T3) -Power dist box (on top of load lock) -Rough pump & backing pump includedOEM 모델 설명
The Perkin-Elmer 4400 Series is a fast cycle, water-cooled load locked system that uses circular or delta style cathodes. It has the advantage of eliminating the need to vent the process chamber for loading and unloading substrates, reducing pump down time, contamination, and target burn-in. This increases material utilization. The system is a general-purpose sputtering system with up to four 8 inch diameter circular cathodes that can use DC Magnetron, RF Magnetron, or RF Diode configurations. These can be sputtered sequentially without breaking vacuum. Power sources are available up to 2 kW RF and 5 kW DC.문서
문서 없음
PERKIN ELMER
4400
검증됨
카테고리
PVD / Sputtering
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
67776
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
PERKIN ELMER
4400
카테고리
PVD / Sputtering
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
67776
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
-Cryo pump on chamber -Load lock turbo, QDP-80 dry pump -2 ch. Auto gas control -2kw RF / 5KW DC -Comes with 4 RF diode / 8 in round targets (2 silicon) -Chamber heat option - digital target & substrate bias meters -RF deposition, etch mode, bias mode, and split power. (T1 & T3) -Power dist box (on top of load lock) -Rough pump & backing pump includedOEM 모델 설명
The Perkin-Elmer 4400 Series is a fast cycle, water-cooled load locked system that uses circular or delta style cathodes. It has the advantage of eliminating the need to vent the process chamber for loading and unloading substrates, reducing pump down time, contamination, and target burn-in. This increases material utilization. The system is a general-purpose sputtering system with up to four 8 inch diameter circular cathodes that can use DC Magnetron, RF Magnetron, or RF Diode configurations. These can be sputtered sequentially without breaking vacuum. Power sources are available up to 2 kW RF and 5 kW DC.문서
문서 없음