
설명
PVD Cluster Tool Missing Parts The main design features of the system include:- a. Sputter up deposition with gravity retaining. No clips or clamps needed. b. S-Gun magnetron advanced DC source. You can run a recipe on the wafer with up to 50 steps with different parameters for sputtering. Each wafer loaded can be run through a different sequence of sputtering. The S-Gun magnetron sputtering system has the following design features. Plasma is produced in the chambers in 2 concentric rings. One for each magnetron and target. Between them, there is the shield region.환경 설정
PVD PM1 ETCH PM2 Al PM3 Cu PM4 NiV PM5 TiOEM 모델 설명
Endeavor AT – an exceptional single-wafer processing solution designed in a cluster style and operating within a high-vacuum environment. The innovative S-Gun sputter source design, protected by a patent, empowers operators with meticulous command over process variables, while also granting the freedom to forge novel processes. Crafted with an unwavering commitment to superior outcomes, streamlined design, user-friendly maintenance, and unwavering dependability, each system exemplifies a dedication to excellence.문서
문서 없음
카테고리
PVD / Sputtering
마지막 검증일: 4일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Deinstalled
제품 ID:
148404
웨이퍼 사이즈:
6"/150mm
빈티지:
1990
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SPUTTERED FILMS INC / SFI
ENDEAVOR AT
카테고리
PVD / Sputtering
마지막 검증일: 4일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Deinstalled
제품 ID:
148404
웨이퍼 사이즈:
6"/150mm
빈티지:
1990
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
PVD Cluster Tool Missing Parts The main design features of the system include:- a. Sputter up deposition with gravity retaining. No clips or clamps needed. b. S-Gun magnetron advanced DC source. You can run a recipe on the wafer with up to 50 steps with different parameters for sputtering. Each wafer loaded can be run through a different sequence of sputtering. The S-Gun magnetron sputtering system has the following design features. Plasma is produced in the chambers in 2 concentric rings. One for each magnetron and target. Between them, there is the shield region.환경 설정
PVD PM1 ETCH PM2 Al PM3 Cu PM4 NiV PM5 TiOEM 모델 설명
Endeavor AT – an exceptional single-wafer processing solution designed in a cluster style and operating within a high-vacuum environment. The innovative S-Gun sputter source design, protected by a patent, empowers operators with meticulous command over process variables, while also granting the freedom to forge novel processes. Crafted with an unwavering commitment to superior outcomes, streamlined design, user-friendly maintenance, and unwavering dependability, each system exemplifies a dedication to excellence.문서
문서 없음