설명
A mask bonding system that transfers the wafer and mask to the sputtering device chamber L after bonding for film deposition processing.환경 설정
Wafer: 8 inches, processed one by one Metal Mask: Φ230 mm × t100 μm Configuration: L chamber × 1 T chamber × 1 Etching chamber × 1 Sputtering chamber × 4 Transfer Chamber: Robot with 2 pick-up specifications Etching Chamber: Power supply antenna 1KW, Bias: 600W, Substrate electrode water-cooled electrostatic chuck Sputtering Chamber: 4 chambers, Cathode: Magnet rotary cathode (upper side), DC: 10KW, Substrate electrode: Water-cooled electrostatic chuckOEM 모델 설명
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ULVAC
SME-200J
검증됨
카테고리
PVD / Sputtering
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
110833
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
ULVAC
SME-200J
카테고리
PVD / Sputtering
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
110833
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
A mask bonding system that transfers the wafer and mask to the sputtering device chamber L after bonding for film deposition processing.환경 설정
Wafer: 8 inches, processed one by one Metal Mask: Φ230 mm × t100 μm Configuration: L chamber × 1 T chamber × 1 Etching chamber × 1 Sputtering chamber × 4 Transfer Chamber: Robot with 2 pick-up specifications Etching Chamber: Power supply antenna 1KW, Bias: 600W, Substrate electrode water-cooled electrostatic chuck Sputtering Chamber: 4 chambers, Cathode: Magnet rotary cathode (upper side), DC: 10KW, Substrate electrode: Water-cooled electrostatic chuckOEM 모델 설명
미제공문서
문서 없음