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KLA-Tencor Corp. has introduced two new enhancements for reticle and photomask inspection: the Advanced Performance Algorithm (APA) and the STARlight High Resolution (HR) option. These enhancements enable accurate and reliable inspection of next-generation 0.25-m reticles, including those with complex optical proximity correction (OPC) geometries. APA is a new feature for the RAPID 300 Series reticle pattern inspection systems, while HR is a new option for the STARlight reticle contamination inspection systems. The STARlight HR option uses the smallest pixel size available in any contamination inspection system to deliver the inspection sensitivity required for 0.25-m lithography. This feature will help increase the lithography process window for both mask shops and wafer fabs by capturing contaminants and particles, even semi-transparent defects, such as stains and transmission errors before they impact wafer production. STARlight HR is available on all SL300, SL301, and SL351 systems as a factory or field upgrade option.