설명
Spare Parts환경 설정
환경 설정 없음OEM 모델 설명
System enables fully automated inspection of the 300mm wafer surface. The system's parallel processing capability allows simultaneous wafer inspection of the front / backside and the edge/bevel – at throughputs of up to 130 wafers per hour. A single rotation of the wafer is sufficient for wafer edge inspection to deliver the detection results and defect images. The image-based technology convinces with 1µm sensitivity and allows for optional high resolution microscopic review of defects.문서
문서 없음
KLA / VISTEC / LEICA
LDS3300 C
검증됨
카테고리
Reticle / Mask Inspection
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Parts Tool
작동 상태:
알 수 없음
제품 ID:
101281
웨이퍼 사이즈:
2"/50mm
빈티지:
2023
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA / VISTEC / LEICA
LDS3300 C
카테고리
Reticle / Mask Inspection
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Parts Tool
작동 상태:
알 수 없음
제품 ID:
101281
웨이퍼 사이즈:
2"/50mm
빈티지:
2023
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Spare Parts환경 설정
환경 설정 없음OEM 모델 설명
System enables fully automated inspection of the 300mm wafer surface. The system's parallel processing capability allows simultaneous wafer inspection of the front / backside and the edge/bevel – at throughputs of up to 130 wafers per hour. A single rotation of the wafer is sufficient for wafer edge inspection to deliver the detection results and defect images. The image-based technology convinces with 1µm sensitivity and allows for optional high resolution microscopic review of defects.문서
문서 없음