설명
Tool is complete, there are no missing parts.환경 설정
FAaST 230 - DP + SPVOEM 모델 설명
The SEMILAB / SDI FAAST 230 DP+SPV is an inspection system for wafer masks that can handle cassettes of up to 200mm wafers. It is designed to quickly monitor heavy metal contamination in a non-contact, in-line manner, including the detection of sub 10^8 atoms/cm^-3 Fe. The system is suitable for medium to high-volume manufacturing environments and features automated wafer handling. It also includes automatic robotic wafer handling, a single open-cassette wafer loading station with various configurable options, and automatic full wafer FAST mapping of diffusion length, Iron, and other recombination centers. Additionally, it has the option for advanced digital SPV functions such as Backsurface Recombination, Steady State Diffusion Length, and Copper measurements.문서
문서 없음
SEMILAB / SDI
FAAST 230 DP+SPV
검증됨
카테고리
Reticle / Mask Inspection
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
15230
웨이퍼 사이즈:
알 수 없음
빈티지:
1999
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SEMILAB / SDI
FAAST 230 DP+SPV
카테고리
Reticle / Mask Inspection
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
15230
웨이퍼 사이즈:
알 수 없음
빈티지:
1999
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Tool is complete, there are no missing parts.환경 설정
FAaST 230 - DP + SPVOEM 모델 설명
The SEMILAB / SDI FAAST 230 DP+SPV is an inspection system for wafer masks that can handle cassettes of up to 200mm wafers. It is designed to quickly monitor heavy metal contamination in a non-contact, in-line manner, including the detection of sub 10^8 atoms/cm^-3 Fe. The system is suitable for medium to high-volume manufacturing environments and features automated wafer handling. It also includes automatic robotic wafer handling, a single open-cassette wafer loading station with various configurable options, and automatic full wafer FAST mapping of diffusion length, Iron, and other recombination centers. Additionally, it has the option for advanced digital SPV functions such as Backsurface Recombination, Steady State Diffusion Length, and Copper measurements.문서
문서 없음