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설명
RTP (RTA300H SVP1) Weight: Main Equipment: 750 kg Power Box (power terminal box): 550 kg Size: Equipment Size (W x L x H): 950 mm x 1707 mm x 1842 mm Power Box Size (W x L x H): 1050 mm x 1050 mm x 2100 mm Condition: No issues Purpose: Rapid thermal processing (RTP) for wafers환경 설정
Additional Equipment: 1 rotary pump, 1 power terminal box Dedicated Spare Parts: NoneOEM 모델 설명
Wafer Size: 8 ~ 12 inch SiC Edge Ring: 6” - 3 wafer, 8" - 1 wafer, 12" - 1 wafer문서
문서 없음
카테고리
RTP/RTA
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
113424
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
NEW YOUNG SYSTEM CO., LTD
RTA-300H
카테고리
RTP/RTA
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
113424
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
RTP (RTA300H SVP1) Weight: Main Equipment: 750 kg Power Box (power terminal box): 550 kg Size: Equipment Size (W x L x H): 950 mm x 1707 mm x 1842 mm Power Box Size (W x L x H): 1050 mm x 1050 mm x 2100 mm Condition: No issues Purpose: Rapid thermal processing (RTP) for wafers환경 설정
Additional Equipment: 1 rotary pump, 1 power terminal box Dedicated Spare Parts: NoneOEM 모델 설명
Wafer Size: 8 ~ 12 inch SiC Edge Ring: 6” - 3 wafer, 8" - 1 wafer, 12" - 1 wafer문서
문서 없음