설명
ML200Plus FH Laser Dining M/C 8-inch laser dicing machine with dicing frame handling system. We have developed a dicing machine equipped with stealth dicing technology (developed by Hamamatsu Photonics) as a stealth dicing engine, exhibiting excellent performance. Feature High Quality Processing nDicing of thin wafers (30μm) made possible The ML200plus FH makes high speed dicing (300mm/s) of thin wafers possible. nMinimal Chipping Chipping has been redically minimized. nCompletely Dry Process As a completely dry process is used, this prosessing technology is perfectly suited to devices averse to moisture, such as optical devices. High Throughput nDices 4 Times Faster than Blade Dicing The ML200Plus FH is able to dice thin wafers of thickness 100μm or thinner at a speed of 300mm/s, contributing significantly to improved throughput. Large Increases in Chip Yield nThe kerf loss necessary for blade dicing has been reduced to 0μm with ML200Plus FH, and dramatic reduction in dicing street width has been made possible. This technology pushes chip yield per wafer to the maximum limit. Improved Yield nImprovements Made in Flexural Strength As wafers are cut internally, avoiding any damage to the wafer surface, chipping on the bottom surface of the wafer is minimized, flexural strength is improved, and breaking strengh when wafers are picked during the packaging process is improved, improving tact in the die bonder process as well as contributing to better yield. nDices 4 Times Faster than Blade Dicing The ML200Plus FH is able to dice thin wafers of thickness 100μm or thinner at a speed of 300mm/s, contributing significantly to improved throughput. nNo Waste Water Disposal Required When processed, the modification layer is formed within the Si, meaning that dust is radically reduced, and resources are not spent on waste water disposal costs. nNo Blade Replacement Required The ML200Plus FH does not use blades, meaning that blade costs are reduced, and labor is not required for blade replacement and quality control of blade wear and tear. nNo Dicing Water Required The process is completely dry, meaning that no 01 water is used. As no contamination occurs, cleaning processes are also unnecessary.환경 설정
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ACCRETECH / TSK
ML200Plus
검증됨
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
112032
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ACCRETECH / TSK
ML200Plus
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
112032
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
ML200Plus FH Laser Dining M/C 8-inch laser dicing machine with dicing frame handling system. We have developed a dicing machine equipped with stealth dicing technology (developed by Hamamatsu Photonics) as a stealth dicing engine, exhibiting excellent performance. Feature High Quality Processing nDicing of thin wafers (30μm) made possible The ML200plus FH makes high speed dicing (300mm/s) of thin wafers possible. nMinimal Chipping Chipping has been redically minimized. nCompletely Dry Process As a completely dry process is used, this prosessing technology is perfectly suited to devices averse to moisture, such as optical devices. High Throughput nDices 4 Times Faster than Blade Dicing The ML200Plus FH is able to dice thin wafers of thickness 100μm or thinner at a speed of 300mm/s, contributing significantly to improved throughput. Large Increases in Chip Yield nThe kerf loss necessary for blade dicing has been reduced to 0μm with ML200Plus FH, and dramatic reduction in dicing street width has been made possible. This technology pushes chip yield per wafer to the maximum limit. Improved Yield nImprovements Made in Flexural Strength As wafers are cut internally, avoiding any damage to the wafer surface, chipping on the bottom surface of the wafer is minimized, flexural strength is improved, and breaking strengh when wafers are picked during the packaging process is improved, improving tact in the die bonder process as well as contributing to better yield. nDices 4 Times Faster than Blade Dicing The ML200Plus FH is able to dice thin wafers of thickness 100μm or thinner at a speed of 300mm/s, contributing significantly to improved throughput. nNo Waste Water Disposal Required When processed, the modification layer is formed within the Si, meaning that dust is radically reduced, and resources are not spent on waste water disposal costs. nNo Blade Replacement Required The ML200Plus FH does not use blades, meaning that blade costs are reduced, and labor is not required for blade replacement and quality control of blade wear and tear. nNo Dicing Water Required The process is completely dry, meaning that no 01 water is used. As no contamination occurs, cleaning processes are also unnecessary.환경 설정
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