설명
Packaging products/wafer dicing machines 6-8-10 inch plate환경 설정
환경 설정 없음OEM 모델 설명
The ADT 7900 series Dicing Saws feature two facing spindles, enabling simultaneous dicing of wafers or packages at a remarkable high throughput. This advanced system offers high accuracy, ensuring precise dicing of products with excellent performance. Additionally, the ADT 7900 series is designed to deliver exceptional results while maintaining a low cost of operation, making it a cost-effective solution for semiconductor manufacturing needs.문서
문서 없음
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Deinstalled
제품 ID:
103702
웨이퍼 사이즈:
6"/150mm, 8"/200mm
빈티지:
2012
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ADVANCED DICING TECHNOLOGIES (ADT)
7900
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Deinstalled
제품 ID:
103702
웨이퍼 사이즈:
6"/150mm, 8"/200mm
빈티지:
2012
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Packaging products/wafer dicing machines 6-8-10 inch plate환경 설정
환경 설정 없음OEM 모델 설명
The ADT 7900 series Dicing Saws feature two facing spindles, enabling simultaneous dicing of wafers or packages at a remarkable high throughput. This advanced system offers high accuracy, ensuring precise dicing of products with excellent performance. Additionally, the ADT 7900 series is designed to deliver exceptional results while maintaining a low cost of operation, making it a cost-effective solution for semiconductor manufacturing needs.문서
문서 없음