설명
Packaging products/wafer dicing machines 6-8-10 inch plate환경 설정
환경 설정 없음OEM 모델 설명
The ADT 7900 series Dicing Saws feature two facing spindles, enabling simultaneous dicing of wafers or packages at a remarkable high throughput. This advanced system offers high accuracy, ensuring precise dicing of products with excellent performance. Additionally, the ADT 7900 series is designed to deliver exceptional results while maintaining a low cost of operation, making it a cost-effective solution for semiconductor manufacturing needs.문서
문서 없음
ADVANCED DICING TECHNOLOGIES (ADT)
7900
검증됨
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 25일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Deinstalled
제품 ID:
103702
웨이퍼 사이즈:
6"/150mm, 8"/200mm
빈티지:
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기ADVANCED DICING TECHNOLOGIES (ADT)
7900
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 25일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Deinstalled
제품 ID:
103702
웨이퍼 사이즈:
6"/150mm, 8"/200mm
빈티지:
2012
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Packaging products/wafer dicing machines 6-8-10 inch plate환경 설정
환경 설정 없음OEM 모델 설명
The ADT 7900 series Dicing Saws feature two facing spindles, enabling simultaneous dicing of wafers or packages at a remarkable high throughput. This advanced system offers high accuracy, ensuring precise dicing of products with excellent performance. Additionally, the ADT 7900 series is designed to deliver exceptional results while maintaining a low cost of operation, making it a cost-effective solution for semiconductor manufacturing needs.문서
문서 없음