설명
Microtome Wafer Cutter, Spindle speed: 40,000 rpm. Power: 3.5 kVA. Three-phase 200V. Weight: 500 kg.환경 설정
환경 설정 없음OEM 모델 설명
The DAD321 is an automatic dicing/cutting saw made by Disco Corporation. It is capable of handling wafers up to 6 inches in diameter and features an automatic theta rotation system. The unit is only 500mm wide and has a new 1.5kW SynchroSpindle that helps improve product quality.문서
문서 없음
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DISCO
DAD321
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 2일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
140558
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Microtome Wafer Cutter, Spindle speed: 40,000 rpm. Power: 3.5 kVA. Three-phase 200V. Weight: 500 kg.환경 설정
환경 설정 없음OEM 모델 설명
The DAD321 is an automatic dicing/cutting saw made by Disco Corporation. It is capable of handling wafers up to 6 inches in diameter and features an automatic theta rotation system. The unit is only 500mm wide and has a new 1.5kW SynchroSpindle that helps improve product quality.문서
문서 없음