설명
Wafer dicing saw환경 설정
- Workplace size (mm) : ø150 - Spindle Layout : Single - Spindle Output (kw) : 1.5 at 30,000 min-1 - Spindle Max. revolution speed (min-1) : 40,000 - X-axis Feed speed range (mm/s) : 0.1 - 500 - Y-axis Index step (mm) : 0.0001 - Y-axis Positioning accuracy (mm) : - Z-axis Repeating accuracy (mm) : 0.001 - Z-axis Max. blade size (mm) : ø58OEM 모델 설명
The DAD3220 is an automatic dicing saw designed for compactness and compatible with 6 × 6-inch workpieces using a user-specified specification. It has a Φ150 mm single spindle and features an LCD touch panel with a graphical user interface for easy and intuitive operation.문서
문서 없음
DISCO
DAD3220
검증됨
카테고리
Scribing, Cutting, Dicing
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
66767
웨이퍼 사이즈:
8"/200mm
빈티지:
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기DISCO
DAD3220
검증됨
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
66767
웨이퍼 사이즈:
8"/200mm
빈티지:
2011
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Wafer dicing saw환경 설정
- Workplace size (mm) : ø150 - Spindle Layout : Single - Spindle Output (kw) : 1.5 at 30,000 min-1 - Spindle Max. revolution speed (min-1) : 40,000 - X-axis Feed speed range (mm/s) : 0.1 - 500 - Y-axis Index step (mm) : 0.0001 - Y-axis Positioning accuracy (mm) : - Z-axis Repeating accuracy (mm) : 0.001 - Z-axis Max. blade size (mm) : ø58OEM 모델 설명
The DAD3220 is an automatic dicing saw designed for compactness and compatible with 6 × 6-inch workpieces using a user-specified specification. It has a Φ150 mm single spindle and features an LCD touch panel with a graphical user interface for easy and intuitive operation.문서
문서 없음