설명
Microtome Cutter, only minor signs of use. No maintenance required. Equipped with a 1.8kW spindle capable of cutting wafers up to 250mm diameter. Supports processing of materials including optical communication V-grooves, glass, and printed circuit boards with high precision and stable performance.환경 설정
환경 설정 없음OEM 모델 설명
The Disco DAD3350 is an automatic dicing saw that supports a wide range of applications. It is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard. By selecting a 2.2 kW high-torque spindle (optional), it is possible to process silicon up to difficult-to-process materials, such as ceramic.문서
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DISCO
DAD3350
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 2일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
140559
웨이퍼 사이즈:
알 수 없음
빈티지:
2012
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Microtome Cutter, only minor signs of use. No maintenance required. Equipped with a 1.8kW spindle capable of cutting wafers up to 250mm diameter. Supports processing of materials including optical communication V-grooves, glass, and printed circuit boards with high precision and stable performance.환경 설정
환경 설정 없음OEM 모델 설명
The Disco DAD3350 is an automatic dicing saw that supports a wide range of applications. It is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard. By selecting a 2.2 kW high-torque spindle (optional), it is possible to process silicon up to difficult-to-process materials, such as ceramic.문서
문서 없음