설명
Fully automatic wafer dicing saw for up to 8-inch wafers. Single spindle configuration, 1.0 kW spindle. Laser specifications and laser hours: N/A. Cutting material: Not specified.환경 설정
환경 설정 없음OEM 모델 설명
DFD641 has a maximum workpiece size of an ø8” wafer and features a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. DFD641 also offers enhanced productivity through automatic alignment and is suitable for applications involving semiconductor devices."문서
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DISCO
DAD641
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 9일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Deinstalled
제품 ID:
153663
웨이퍼 사이즈:
알 수 없음
빈티지:
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Fully automatic wafer dicing saw for up to 8-inch wafers. Single spindle configuration, 1.0 kW spindle. Laser specifications and laser hours: N/A. Cutting material: Not specified.환경 설정
환경 설정 없음OEM 모델 설명
DFD641 has a maximum workpiece size of an ø8” wafer and features a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. DFD641 also offers enhanced productivity through automatic alignment and is suitable for applications involving semiconductor devices."문서
문서 없음