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DISCO DFD6340 Wafer Dicing Saw Configured: 150mm Process: Half Cut Dicing Spindle Blade: 2” Spindle Power: 1.2kW NCS BBDOEM 모델 설명
The Disco DFD6340 is a Fully Automatic Dicing Saw that features a facing dual-spindle configuration with a shorter distance between blades, which improves throughput by up to 30% for step/bevel cut and 40% for dual cut when compared with parallel dual spindle dicing saws. It has the smallest footprint of any 8" saw in its class and utilizes an adjustable LCD touch screen graphical user interface making operation and maintenance intuitive and easy.문서
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DISCO
DFD6340
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
113448
웨이퍼 사이즈:
알 수 없음
빈티지:
2015
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설명
설명 없음환경 설정
DISCO DFD6340 Wafer Dicing Saw Configured: 150mm Process: Half Cut Dicing Spindle Blade: 2” Spindle Power: 1.2kW NCS BBDOEM 모델 설명
The Disco DFD6340 is a Fully Automatic Dicing Saw that features a facing dual-spindle configuration with a shorter distance between blades, which improves throughput by up to 30% for step/bevel cut and 40% for dual cut when compared with parallel dual spindle dicing saws. It has the smallest footprint of any 8" saw in its class and utilizes an adjustable LCD touch screen graphical user interface making operation and maintenance intuitive and easy.문서
문서 없음