설명
DISCO DFD6360 Fully Automatic Dicing Saw Manufacturer: DISCO Model: DFD6360 Equipment Type: Fully Automatic Dicing Saw Maximum Workpiece Size: 300 mm (12 inch) Spindle Configuration: Facing Dual Spindle Spindle Quantity: 2 Spindle Type: Air Bearing Spindle Power: 1.2 kW Spindle Speed: 6,000–60,000 rpm X-axis Cutting Range: 310 mm X-axis Cutting Speed: 0.1–600 mm/s Y-axis Index Step: 0.0001 mm Positioning Accuracy: ±0.002 mm / 310 mm Z-axis Repeatability: 0.001 mm Maximum Blade Size: 2 inch Theta-axis Rotation: 380 degrees Machine Dimensions: 1,200 × 1,550 × 1,800 mm Machine Weight: Approx. 2,050 kg Fully automatic dicing saw featuring a facing dual-spindle configuration for precision wafer processing.환경 설정
환경 설정 없음OEM 모델 설명
The DFD6360 workpiece has a maximum diameter of ø304.8 mm (ø12"). The air bearing spindle is a 1.0 kW Synchro Spindle and the maximum blade size is 61 mm. The spindle configuration is facing dual-spindles. The process method includes dual cut and step and bevel cut, which effectively reduces front and backside chipping and improves die strength. The graphical user interface allows for intuitive operation. This is suitable for applications such as semiconductor devices, ceramics, and glass.문서
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DISCO
DFD6360
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 8일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Deinstalled
제품 ID:
153645
웨이퍼 사이즈:
알 수 없음
빈티지:
2005
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
DISCO DFD6360 Fully Automatic Dicing Saw Manufacturer: DISCO Model: DFD6360 Equipment Type: Fully Automatic Dicing Saw Maximum Workpiece Size: 300 mm (12 inch) Spindle Configuration: Facing Dual Spindle Spindle Quantity: 2 Spindle Type: Air Bearing Spindle Power: 1.2 kW Spindle Speed: 6,000–60,000 rpm X-axis Cutting Range: 310 mm X-axis Cutting Speed: 0.1–600 mm/s Y-axis Index Step: 0.0001 mm Positioning Accuracy: ±0.002 mm / 310 mm Z-axis Repeatability: 0.001 mm Maximum Blade Size: 2 inch Theta-axis Rotation: 380 degrees Machine Dimensions: 1,200 × 1,550 × 1,800 mm Machine Weight: Approx. 2,050 kg Fully automatic dicing saw featuring a facing dual-spindle configuration for precision wafer processing.환경 설정
환경 설정 없음OEM 모델 설명
The DFD6360 workpiece has a maximum diameter of ø304.8 mm (ø12"). The air bearing spindle is a 1.0 kW Synchro Spindle and the maximum blade size is 61 mm. The spindle configuration is facing dual-spindles. The process method includes dual cut and step and bevel cut, which effectively reduces front and backside chipping and improves die strength. The graphical user interface allows for intuitive operation. This is suitable for applications such as semiconductor devices, ceramics, and glass.문서
문서 없음