설명
Wafer Dicing Saw환경 설정
환경 설정 없음OEM 모델 설명
The DFD6363 is a flagship model for Φ300 mm wafers with high process extensibility. It is compatible with both frame and two-way (frame/wafer) transferring and supports various processes, including full cut and half cut, with only one DFD6363. This reduces size conversion operations and human error. It also supports both standard cassettes (Φ200 mm / Φ300 mm) and FOUP cassettes.문서
문서 없음
DISCO
DFD6363
검증됨
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 16일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
116264
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DISCO
DFD6363
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 16일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
116264
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Wafer Dicing Saw환경 설정
환경 설정 없음OEM 모델 설명
The DFD6363 is a flagship model for Φ300 mm wafers with high process extensibility. It is compatible with both frame and two-way (frame/wafer) transferring and supports various processes, including full cut and half cut, with only one DFD6363. This reduces size conversion operations and human error. It also supports both standard cassettes (Φ200 mm / Φ300 mm) and FOUP cassettes.문서
문서 없음