설명
설명 없음환경 설정
Process: Wafer Dicing Mode: Fully-autoOEM 모델 설명
The Disco DFD641 has a maximum workpiece size of an ø8" wafer and is equipped with a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. It also features enhanced productivity with automatic alignment and is suitable for semiconductor device applications.문서
문서 없음
DISCO
DFD641
검증됨
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
116468
웨이퍼 사이즈:
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
빈티지:
1995
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
DISCO
DFD641
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
116468
웨이퍼 사이즈:
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
빈티지:
1995
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
Process: Wafer Dicing Mode: Fully-autoOEM 모델 설명
The Disco DFD641 has a maximum workpiece size of an ø8" wafer and is equipped with a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. It also features enhanced productivity with automatic alignment and is suitable for semiconductor device applications.문서
문서 없음