설명
**DISCO DFD641 – Fully Automatic Dicing Saw** **General Specifications** * Manufacturer: DISCO Corporation * Model: DFD641 * Equipment Type: Fully Automatic Dicing Saw * Spindle Configuration: Single Spindle * Maximum Wafer Size: 8-inch (200 mm) **Features** * Automatic wafer frame loading and unloading * Automatic wafer alignment * Fully automatic dicing process * Automatic cleaning and drying * High-output, low-vibration spindle system * Suitable for semiconductor wafer dicing applications *Technical specifications and options should be confirmed according to the actual machine configuration.*환경 설정
환경 설정 없음OEM 모델 설명
The Disco DFD641 has a maximum workpiece size of an ø8" wafer and is equipped with a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. It also features enhanced productivity with automatic alignment and is suitable for semiconductor device applications.문서
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DISCO
DFD641
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 8일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Deinstalled
제품 ID:
153614
웨이퍼 사이즈:
알 수 없음
빈티지:
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
**DISCO DFD641 – Fully Automatic Dicing Saw** **General Specifications** * Manufacturer: DISCO Corporation * Model: DFD641 * Equipment Type: Fully Automatic Dicing Saw * Spindle Configuration: Single Spindle * Maximum Wafer Size: 8-inch (200 mm) **Features** * Automatic wafer frame loading and unloading * Automatic wafer alignment * Fully automatic dicing process * Automatic cleaning and drying * High-output, low-vibration spindle system * Suitable for semiconductor wafer dicing applications *Technical specifications and options should be confirmed according to the actual machine configuration.*환경 설정
환경 설정 없음OEM 모델 설명
The Disco DFD641 has a maximum workpiece size of an ø8" wafer and is equipped with a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. It also features enhanced productivity with automatic alignment and is suitable for semiconductor device applications.문서
문서 없음