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설명
Scribing Dicing환경 설정
환경 설정 없음OEM 모델 설명
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.문서
문서 없음
PREFERRED
SELLER
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 30일 이상 전
Buyer pays 12% premium of final sale price
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
126269
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
PREFERRED
SELLER
DISCO
DFL7340
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 30일 이상 전
Buyer pays 12% premium of final sale price
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
126269
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Scribing Dicing환경 설정
환경 설정 없음OEM 모델 설명
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.문서
문서 없음