설명
Laser saw Die separator DFL7362 is DISCO laser saw(Not back grinder), and it is with DDS2300, wafer sorter in turn key.환경 설정
Chuck/table size (Has 12 inch spec now) - Usage : Laser Diode - 1306.60 Hrs. Laser Head - 19082.40 Hrs. - Laser Source Type : SD06 typeOEM 모델 설명
2017 Developed DFL7362, a stealth dicing laser saw that achieves higher throughput. Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si Φ300 mm Stealth Dicing™ SDBG SDTT DFL7362 is a fully-automatic laser saw for Φ300 mm wafers used mainly to singulate ultra-thin Si wafers. Si with a thickness of 50 µm or less can be singulated at high speed while maintaining high die strength. The equipment offers both wafer and frame transferring, making it possible to support a wide range of applications.문서
DISCO
DFL7362
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 5일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
128847
웨이퍼 사이즈:
12"/300mm
빈티지:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available