We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 더 알아보기
설명
6S Auto AOI After Saw Singulation with Wafer Sorter -Pickup force: 50~150g -Dimension: 2950(W)x1550(D)x1650(H) mm /x 2130mm(H) withmsignal tower / weight < 3800Kg환경 설정
-Machine Cycle Time: ≦ 0.6 sec/chip (exclude process time) -Accuracy: X,Y= ± 40μm , θ=± 0.2° -Chip size: 0.7mm～10 mm (option: customized) -Die Thickness: 0.10 mm～0.7 mm (2mil Option) -Wafer Size: 12” Standard (8” Option) -Wafer Load/Unload: Automatic -Mapping: Easy mapping / file mapping -Ejector Needle: Dual needle unit / Programmable Speed & Height control Option Function: -Topside /Backside insp. Chipping, Crack, Residue glue , defect size>10um -Side wall inspection Chipping, Crack, defect size>10um (option) -inspection resolution 2.7um/pixel -Wafer Ring for place 12” Standard (8” Option) feeding by 12” XY table -Ring Load/Unload 12” wafer ring auto load/unload by Cassette -NG die output Place bad die(by inspection)on tray for rework or -review (Option: 6” film frame) -Barcode reader For mapping file confirming -SECS For mapping data transfer (option)OEM 모델 설명
미제공문서
GMM
6S
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
46623
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available