설명
6S Auto AOI After Saw Singulation with Wafer Sorter -Pickup force: 50~150g -Dimension: 2950(W)x1550(D)x1650(H) mm /x 2130mm(H) withmsignal tower / weight < 3800Kg환경 설정
-Machine Cycle Time: ≦ 0.6 sec/chip (exclude process time) -Accuracy: X,Y= ± 40μm , θ=± 0.2° -Chip size: 0.7mm～10 mm (option: customized) -Die Thickness: 0.10 mm～0.7 mm (2mil Option) -Wafer Size: 12” Standard (8” Option) -Wafer Load/Unload: Automatic -Mapping: Easy mapping / file mapping -Ejector Needle: Dual needle unit / Programmable Speed & Height control Option Function: -Topside /Backside insp. Chipping, Crack, Residue glue , defect size>10um -Side wall inspection Chipping, Crack, defect size>10um (option) -inspection resolution 2.7um/pixel -Wafer Ring for place 12” Standard (8” Option) feeding by 12” XY table -Ring Load/Unload 12” wafer ring auto load/unload by Cassette -NG die output Place bad die(by inspection)on tray for rework or -review (Option: 6” film frame) -Barcode reader For mapping file confirming -SECS For mapping data transfer (option)OEM 모델 설명
미제공문서
GMM
6S
검증됨
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
46623
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
GMM
6S
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
46623
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available