THERMOFISHER SCIENTIFIC / FEI / PHILIPS Helios 5 PFIB UXe

설명

Has been under continuous performance enhanced service contract, though service contract is non-transferable.

환경 설정

Platform Dual-beam: Elstar XHR FE-SEM + inductively coupled Xe plasma FIB, mounted at 52° Electron source Schottky field emitter on NG hot-swap gun module with UC+ technology (energy spread < 0.2 eV) SEM accel. / landing 350 V – 30 kV acceleration; landing energies 20 V – 30 kV SEM resolution 0.6 nm @ 2–15 keV (at optimum working distance) SEM beam current 0.8 pA – 100 nA (0.8 pA – 100 pA in UC mode) Ion source Inductively coupled Xe plasma; source lifetime > 2 years Ion landing / current 500 V – 30 kV; 1 pA – 2.5 μA in 14 steps (@ 30 kV) Ion resolution < 20 nm @ 30 kV (statistical); < 10 nm @ 30 kV (selective edge) Stage 5-axis motorized eucentric (x-y-z-rotate-tilt); 150 × 150 mm travel; tilt –38° to +60°; piezo x/y/rotation; 100 nm min. step Chamber 21-accessory-port specimen chamber; 4 GIS ports; 4 mm coincidence point Vacuum Entirely oil-free differential-pumped system; UHV source operation (~10⁻¹⁰ bar) Scanning Digital engine to 6144 × 4096; snapshots to 64k × 64k; 25 ns/pixel min. dwell Patterning 16-bit engine, max 64k × 64k; Simultaneous Pattern & Imaging (SPI); 3D variable-dwell milling; bitmap import Standard detectors In-lens TLD (SE/BSE), Everhart-Thornley SED, and ICE detector (secondary ion + electron) Standard imaging aids Integrated IR-CCD overview camera, integrated plasma cleaner, beam-current measurement, SEM protective shutter, integrated Real-Time Monitor (iRTM) Control software xT Software v17.26.0 on dedicated microscope controller + Windows 10 support computer; dual 24″ monitors; RAPID remote-diagnostics enabled Imaging & detection upgrades • Elstar In-Column Detector — high-sensitivity in-column BSE detection; superb low-landing-energy imaging. • Retractable DBS Detector — segmented solid-state backscatter detector for tunable material/topographic contrast. • Retractable STEM 3+ Detector — bright-, dark-, and high-angle dark-field STEM imaging of thin samples (incl. STEM/DBS Integration & Upgrade Kits). • Electron Beam Deceleration — ultra-low landing energies down to 20 V; 0.7 nm @ 1 keV, 1.0 nm @ 500 eV, 1.1 nm @ 350 eV. • Charge Neutralizer — enables milling/imaging of fully non-conducting samples. • In-Chamber Nav-Cam — color optical navigation camera, ~6 MP, registered to SEM coordinates. Sample preparation, deposition & manipulation • EasyLift EX NanoManipulator — motorized in-situ lift-out and TEM lamella transfer. • MultiChem Gas Delivery System — up to 6 chemistries for gas-assisted etch/deposition and a 120 VAC air-filtration unit. No precursor consumables included. • AutoTEM 5 — automated S/TEM sample-prep and cross-sectioning software. • iFast Developer’s Tool Kit Professional — graphical recipe creation/editing for automated workflows. Sample handling & holders • Quick Loader (load-lock) with Quick-Loader-compatible STEM holder; ~25 s pump time. • UMB Stub Holder Kit, UMB FIB/TEM Specimen Kit, Row Holder for TEM grids, and Load Base. Operator control accessories • Manual User Interface (MUI), control Joystick, and Remote Control / Imaging (Radmin perpetual license). Site, environment & service infrastructure • Active Vibration Isolation System and Seismic Restraint Kit (S2-compliance ready). • System Covers, dual acoustic enclosures for the pre-vacuum pump, and an oil-free 108 l/min compressor. • APC 5 kVA UPS and a Mains Matching & Isolation Transformer.