설명

• Field Proven 3D Vision Sensing Technology • High Resolution 3D sensing technology • Built-in Fiducial camera & lighting • Great for Demanding Assemblies • 3D Height, True Volume & Area measurements for CSPs, 0201s or small pad sizes • 3D shaded view for examining solder paste deposits • Registration Measurement • Bridge Detection for Fine Tune printer setup/monitor process drift • XML format output • Adjustable-width, clamping conveyor systems • CD-RW, Ethernet connection, USB ports, RS-232 ports, parallel port and 3.5” disk drive • Dimensions (h x w x d) 200 x 98 x 125 • Weight 860 kg (1900 lbs.) • Panel Size Capacity: Maximum 508 x 508 mm (20 x 20 in.) Minimum 101 x 40 mm (4 x 1.5 in.) • Maximum Panel Weight: 3 kg (6.6 lb.) • Board Thickness 0.5 to 5 mm (0.02 to 0.2 in.) • Board Edge Clearance: Top 2.5 mm (0.10 in.) Bottom 3 mm (0.12 in.) • Underside Component Clearance: 25.4 mm (1 in.) • Conveyor Speed Range: 150-450 mm/sec (5.9-17.7 in/sec) • Conveyor Height: 889 to 990 mm (35 to 39 in.) • Laser Range Finder: 640-870 nm, 1mW max, (built into sensor) Class II • Maximum Inspection Area: 508 x 503 mm (20 x 19.5 in.) • Maximum Pad Size: in 5 x 10 mm • FOV (0.197 x 0.394 in.)

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OEM 모델 설명

CyberOptics 100% 3D solder paste inspection system, the SE 300 ultra, provides accurate and repeatable results at speeds that keep up with the increasing pace of you line. Using field-proven 3D vision sensing technology, the SE 300 Ultra is the best choice for optimizing your post-print inspection and process control.