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설명
설명 없음환경 설정
3D SPI system inline 3 D camera min. paste size 150x150µm max. paste size 20x20mm max. paste hight 1000µm min. PCB size 50x50mm max. PCB size 500x510m PCB thickness 0,4mm - 4mm measurements 1060mm (width) x 1285mm (length) x 1400mm (hight) weight 1000 kg Ask for additional information!OEM 모델 설명
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PARMI
HS60L
카테고리
Solder Paste Inspection
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Deinstalled
제품 ID:
114018
웨이퍼 사이즈:
알 수 없음
빈티지:
2012
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
3D SPI system inline 3 D camera min. paste size 150x150µm max. paste size 20x20mm max. paste hight 1000µm min. PCB size 50x50mm max. PCB size 500x510m PCB thickness 0,4mm - 4mm measurements 1060mm (width) x 1285mm (length) x 1400mm (hight) weight 1000 kg Ask for additional information!OEM 모델 설명
미제공문서
문서 없음