설명
Dual SRD 20170324 8300 GHP 12724/12725환경 설정
환경 설정 없음OEM 모델 설명
This high performance tool cleans, rinses and dries product as large as 300mm round or 300mm square. With 25 wafers per chamber, this tool is available in single or double-bowl configurations. Introduced in 1979, over 25,000 units have shipped worldwide. The SRD can be configured to benchtop, stand-alone or bulkhead fab requirements. FEATURES Spray - On-axis orientation allows cold or hot (>50ºC) water to evenly spray the wafers Clean/Rinse - Built-in resistivity monitoring assures an automatic and reliable clean: the process chamber is cleaned with the product: quick-ramp, brushless DC motor provides economy and efficiency Dry - Centrifugal drying, coupled with heated, filtered nitrogen and a low-pressure nitrogen purge with blanket heaters Efficient Chamber Design Flexible - Easy to change rotors for simple reconfiguration to match any array of applications Fast - A typical 25-wafer payload takes <7 minutes for a complete cycle (load, rinse, spin dry, unload) Ultra Clean - On-axis orientation keeps wafers parallel, allowing fresh DI water manifolds to spray both sides of the product uniformly Efficient - Up to ten user-defined recipes Low CoO - Smallest footprint with the highest throughput available with over 95% uptime RELATED PROCESSES AND TECHNOLOGIES PROCESSES SUPPORTED Spray Clean (SRD) Spin-Rinse-DrySpray Clean (SRD) Spin-Rinse-Dry문서
문서 없음
SEMITOOL
SRD-8300S
검증됨
카테고리
SRD
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
55502
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SEMITOOL
SRD-8300S
카테고리
SRD
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
55502
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Dual SRD 20170324 8300 GHP 12724/12725환경 설정
환경 설정 없음OEM 모델 설명
This high performance tool cleans, rinses and dries product as large as 300mm round or 300mm square. With 25 wafers per chamber, this tool is available in single or double-bowl configurations. Introduced in 1979, over 25,000 units have shipped worldwide. The SRD can be configured to benchtop, stand-alone or bulkhead fab requirements. FEATURES Spray - On-axis orientation allows cold or hot (>50ºC) water to evenly spray the wafers Clean/Rinse - Built-in resistivity monitoring assures an automatic and reliable clean: the process chamber is cleaned with the product: quick-ramp, brushless DC motor provides economy and efficiency Dry - Centrifugal drying, coupled with heated, filtered nitrogen and a low-pressure nitrogen purge with blanket heaters Efficient Chamber Design Flexible - Easy to change rotors for simple reconfiguration to match any array of applications Fast - A typical 25-wafer payload takes <7 minutes for a complete cycle (load, rinse, spin dry, unload) Ultra Clean - On-axis orientation keeps wafers parallel, allowing fresh DI water manifolds to spray both sides of the product uniformly Efficient - Up to ten user-defined recipes Low CoO - Smallest footprint with the highest throughput available with over 95% uptime RELATED PROCESSES AND TECHNOLOGIES PROCESSES SUPPORTED Spray Clean (SRD) Spin-Rinse-DrySpray Clean (SRD) Spin-Rinse-Dry문서
문서 없음