설명
Fully automated wafer support system Frame-mounted wafer laser debonding and adhesive removal system환경 설정
(Qty 6) load ports Configured for Taiko wafer debonding Process: IR laser degradation of the LTHC layer for glass carrier removal Loading / unloading: (Qty 2) FOUP stations / (Qty 2) Frame cassette stations Wafer handling: Returns processed wafers to the original cassette and slot Glass carrier handling: Robotic removal to a 25-piece FOUP Transfer system: Rotary table with vacuum chucks Adhesive removal: Peel tape unit with remaining-tape sensor monitoring Peel tape roll length: 100 m Recipe controls: Laser current, frequency and speed; peel speed and position profiles; frame orientation Identification: Wafer barcode / Glass QR code / Frame label reading Network: TCP/IP Specified throughput target: ≥20 wafers/hourOEM 모델 설명
미제공문서
문서 없음
카테고리
Support Equipment
마지막 검증일: 5일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
154854
웨이퍼 사이즈:
알 수 없음
빈티지:
2021
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SCIENTECH
Pyxis 3001-TDB
카테고리
Support Equipment
마지막 검증일: 5일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
154854
웨이퍼 사이즈:
알 수 없음
빈티지:
2021
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Fully automated wafer support system Frame-mounted wafer laser debonding and adhesive removal system환경 설정
(Qty 6) load ports Configured for Taiko wafer debonding Process: IR laser degradation of the LTHC layer for glass carrier removal Loading / unloading: (Qty 2) FOUP stations / (Qty 2) Frame cassette stations Wafer handling: Returns processed wafers to the original cassette and slot Glass carrier handling: Robotic removal to a 25-piece FOUP Transfer system: Rotary table with vacuum chucks Adhesive removal: Peel tape unit with remaining-tape sensor monitoring Peel tape roll length: 100 m Recipe controls: Laser current, frequency and speed; peel speed and position profiles; frame orientation Identification: Wafer barcode / Glass QR code / Frame label reading Network: TCP/IP Specified throughput target: ≥20 wafers/hourOEM 모델 설명
미제공문서
문서 없음