설명
Evaporation table환경 설정
환경 설정 없음OEM 모델 설명
The CHA Mark 50 is a high vacuum deposition system that has become the industry standard due to its simplicity in design, ease of operation and unmatched reliability. It’s an excellent choice for a wide range of applications. he CHA Mark 50 has a horizontal 32" by 32" water-cooled cylindrical chamber that simplifies loading and unloading. It also has a unique slide down front door that minimizes floor space requirements and a rear door that offers easy chamber access from behind for convenient through the wall mounting. It is SECS/GEM and CE compliant. Some of its features include dual operation (sputtering and evaporation), moving substrates, exceptional film uniformity (fixture dependent), sputter up process stations, round cathodes (RF or DC, up to 4 stations), co-deposit bias (RF or DC), substrate heating (400°C, multi-element), electron beam, thermal ion beam pre-clean/etch, plasma texturing/etch and power supply options.문서
문서 없음
CHA
MARK 50C
검증됨
카테고리
Thermal Evaporators
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
115082
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
CHA
MARK 50C
카테고리
Thermal Evaporators
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
115082
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Evaporation table환경 설정
환경 설정 없음OEM 모델 설명
The CHA Mark 50 is a high vacuum deposition system that has become the industry standard due to its simplicity in design, ease of operation and unmatched reliability. It’s an excellent choice for a wide range of applications. he CHA Mark 50 has a horizontal 32" by 32" water-cooled cylindrical chamber that simplifies loading and unloading. It also has a unique slide down front door that minimizes floor space requirements and a rear door that offers easy chamber access from behind for convenient through the wall mounting. It is SECS/GEM and CE compliant. Some of its features include dual operation (sputtering and evaporation), moving substrates, exceptional film uniformity (fixture dependent), sputter up process stations, round cathodes (RF or DC, up to 4 stations), co-deposit bias (RF or DC), substrate heating (400°C, multi-element), electron beam, thermal ion beam pre-clean/etch, plasma texturing/etch and power supply options.문서
문서 없음