설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The NanoSpec 8300X is a film thickness measuring system designed by Nanometrics for the semiconductor industry. It was first introduced in July 1996 at the SEMICON/West trade show and is capable of handling both 200mm and 300mm diameter wafers. The system incorporates both a spectroscopic ellipsometer and spectrophotometer, enabling it to accurately measure and analyze virtually any dielectric film used in semiconductor manufacture today. The development of the NanoSpec 8300X was part of a project launched by SEMATECH, a consortium of large U.S. semiconductor manufacturers, to develop tools for the eventual industry shift to the manufacture of ICs on 300mm semiconductor wafers, which are designed to allow lower production cost due to the ability to simultaneously manufacture many more chips per wafer.문서
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ONTO / NANOMETRICS / ACCENT / BIO-RAD
NANOSPEC 8300X
검증됨
카테고리
Thin Film / Film Thickness
마지막 검증일: 어제
주요 품목 세부 정보
조건:
Parts Tool
작동 상태:
알 수 없음
제품 ID:
114479
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ONTO / NANOMETRICS / ACCENT / BIO-RAD
NANOSPEC 8300X
카테고리
Thin Film / Film Thickness
마지막 검증일: 어제
주요 품목 세부 정보
조건:
Parts Tool
작동 상태:
알 수 없음
제품 ID:
114479
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The NanoSpec 8300X is a film thickness measuring system designed by Nanometrics for the semiconductor industry. It was first introduced in July 1996 at the SEMICON/West trade show and is capable of handling both 200mm and 300mm diameter wafers. The system incorporates both a spectroscopic ellipsometer and spectrophotometer, enabling it to accurately measure and analyze virtually any dielectric film used in semiconductor manufacture today. The development of the NanoSpec 8300X was part of a project launched by SEMATECH, a consortium of large U.S. semiconductor manufacturers, to develop tools for the eventual industry shift to the manufacture of ICs on 300mm semiconductor wafers, which are designed to allow lower production cost due to the ability to simultaneously manufacture many more chips per wafer.문서
문서 없음