We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 더 알아보기
설명
FILM THICKNESS MEASUREMENT환경 설정
환경 설정 없음OEM 모델 설명
The NanoSpec 9200 is an advanced film analysis system that provides DUV-visible spectroscopic reflectometry. It has a small footprint and high throughput, making it a highly efficient tool for analyzing film thickness and material optical constants. The system can handle both 150mm and 200mm wafers and is capable of measuring up to 200 wafers per hour. It features the latest generation spectroscopic reflectometer, pattern recognition, auto-focus, auto-positioning stage, and robotic wafer handling capabilities. This makes it a fast, reliable, compact, and cost-effective tool for volume production in the IC manufacturing industry.문서
문서 없음
카테고리
Thin Film / Film Thickness
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
78321
웨이퍼 사이즈:
8"/200mm
빈티지:
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ONTO / NANOMETRICS / ACCENT / BIO-RAD
NANOSPEC 9200
카테고리
Thin Film / Film Thickness
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
78321
웨이퍼 사이즈:
8"/200mm
빈티지:
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
FILM THICKNESS MEASUREMENT환경 설정
환경 설정 없음OEM 모델 설명
The NanoSpec 9200 is an advanced film analysis system that provides DUV-visible spectroscopic reflectometry. It has a small footprint and high throughput, making it a highly efficient tool for analyzing film thickness and material optical constants. The system can handle both 150mm and 200mm wafers and is capable of measuring up to 200 wafers per hour. It features the latest generation spectroscopic reflectometer, pattern recognition, auto-focus, auto-positioning stage, and robotic wafer handling capabilities. This makes it a fast, reliable, compact, and cost-effective tool for volume production in the IC manufacturing industry.문서
문서 없음