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설명
Tool does have TSV. Tool doesn’t have a TTV (total thickness variation) function.환경 설정
Vacuum wafer chuck for 150mm and 200mm wafer CWL spectrometer 4kHz CWL 600µm sensor CWL FT (10µm) sensor head MHU (wafer handing unit) for 150mm and 200mm Semi standard wafer Prealigner Acquire Automation XT software packages: Film thickness; Step height; Bumps measurement (height, coplanarity, diameter); Roughness;OEM 모델 설명
미제공문서
문서 없음
카테고리
Thin Film / Film Thickness
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
111618
웨이퍼 사이즈:
6"/150mm, 8"/200mm
빈티지:
2011
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
FORM FACTOR / CASCADE MICROTECH / FRT
MICROPROF 200
카테고리
Thin Film / Film Thickness
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
111618
웨이퍼 사이즈:
6"/150mm, 8"/200mm
빈티지:
2011
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Tool does have TSV. Tool doesn’t have a TTV (total thickness variation) function.환경 설정
Vacuum wafer chuck for 150mm and 200mm wafer CWL spectrometer 4kHz CWL 600µm sensor CWL FT (10µm) sensor head MHU (wafer handing unit) for 150mm and 200mm Semi standard wafer Prealigner Acquire Automation XT software packages: Film thickness; Step height; Bumps measurement (height, coplanarity, diameter); Roughness;OEM 모델 설명
미제공문서
문서 없음