MicroSense has a singular focus on precision measurement. Provide customers with state-of-the-art measurement performance products - precision capacitive sensors for high resolution, non-contact position sensing; vibrating sample magnetometers and MOKE systems for magnetic property measurement; and wafer metrology systems for accurately measuring wafer thickness and shape.

150/200mm bridge tool for Si, SiC, GaN, GaAs (on sapphire, SiC or Si), Ge and epitaxy processes. 
Automatic, non-contact measurement of filmed, patterned and bare wafers -150mm & 200mm diameter

The MicroSense® CSW1 is formerly known as the UltraMap UMA-C200. The MicroSense CSW1 measurement system provides full wafer, high speed geometry measurement of semiconductor wafers using non-contact capacitance sensors with nanometer level thickness resolution. The system measures the thickness, flatness, bow and warp of the wafer in compliance with SEMI standards. Designed for maximum versatility, the system can measure 150mm and 200mm diameter wafers.  Over 120,000 data are measured on each wafer to generate high resolution wafer maps.

KLA / MICROSENSE

CSW1

The MicroSense® BP1 is formerly known as the UltraMap UMA-200-BP. The MicroSense BP1 wafer measurement system precisely measures wafer thickness, flatness and shape using two patented, noncontact, high resolution, auto-positioning back pressure probes. The BP1 is an extremely flexible system that can measure a wide range of wafer thicknesses and any wafer material. Wafer surface finish has no effect on the measurement – the BP1 measures sawn, lapped or polished wafers. 

The MicroSense® C200L, formerly known as the UltraMap UMA-C200L, and the C200M are industry standard, bare wafer geometry measurement systems used by wafer manufacturers to qualify polished and epitaxial 200mm silicon wafers. Patented dual probe, non-contact capacitance sensors with nanometer resolution offer precise and accurate automated geometry measurements at high throughout. Direct, material-independent, high resolution, high-density measurements (>200,000 data points/200mm wafer) are captured on each wafer to generate 2D and 3D wafer maps. System output metrics include thickness, Total Thickness Variation, bow/warp, wafer P/N type & resistivity as well as flatness measurements for whole wafer, sites, and edge sites. Predefined quality criteria and five cassette hardware configuration allows for flexible wafer sorting options.

C200M

Benchtop automated thickness measurement system with X-Y stage on air bearing for wafers up to 8” round and for square wafers up to 156mmx156mm.
Solar Wafers QA and QC, Cost effective, compact metrology tool for R&D labs for all type of wafers and surfaces.

UltraMap-200B

Make automatic, non-contact measurement of thickness, flatness and shape of wafers up to 4" diameter with this compact system.

UltraMap-100

Automated Wafer Thickness Measurement System
IR interferometry probe technology. Single or dual probes.

Thickness and shape measurement of wafers with backgrinding tape wafer on sawframe, dies on tape, wafer on bumps, SOI, multiple layers, bonded wafers, thickness of Si, plastic, glass, adhesive layers.

Wafer 4" to 12" (100 to 300mm) round or square.

 UltraMap-300IR

Automated Wafer Thickness Measurement System
Cassette to cassette or manual loading. Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution). High volume wafer production control, backgrinding control, Wafer characterization, extreme warp wafers, ultrathin wafers thickness mapping. 

Wafer 4” to 12” (100 to 300mm)

 UltraMap-300

150/200mm bridge tool for Si, SiC, GaN, GaAs (on sapphire, SiC or Si), Ge and epitaxy processes includes 2D stress option.
Automatic, non-contact measurement of filmed, patterned and bare wafers, 150mm & 200mm diameter.

The MicroSense STR1 measurement system provides full wafer, high speed geometry measurements of semiconductor wafers using  non-contact capacitance sensors with nanometer level thickness resolution. The system measures the thickness, flatness, bow and warp of the wafer in compliance with SEMI standards. MicroSense StressMap software provides accurate measurement of wafer stress based on high resolution wafer pre-and post deposition shape data. Over 120,000 data points are measured on each wafer to generate  high resolution wafer maps.

STR1

Precise Automated Measurement for High Volume Silicon Wafer Manufacturing 
The MicroSense® C200L, formerly known as the UltraMap UMA-C200L, and the C200M are industry standard, bare wafer geometry measurement systems used by wafer manufacturers to qualify polished and epitaxial 200mm silicon wafers. Patented dual probe, non-contact capacitance sensors with nanometer resolution offer precise and accurate automated geometry measurements at high throughout. Direct, material-independent, high resolution, high-density measurements (>200,000 data points/200mm wafer) are captured on each wafer to generate 2D and 3D wafer maps. System output metrics include thickness, Total Thickness Variation, bow/warp, wafer P/N type & resistivity as well as flatness measurements for whole wafer, sites, and edge sites. Predefined quality criteria and five cassette hardware configuration allows for flexible wafer sorting options.

C200L

MicroSense PV-6060 Non-Contact Photovoltaic Wafer Thickness, TTV and Resistivity Measurement Module.
5 mm diameter sensors are used for thickness measurement, providing high spatial resolution and measurement close to wafer edge.

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

KLA / MICROSENSE

개요

활성 등재물

총 제품 수

서비스

상위 KLA / MICROSENSE Thin Film / Film Thickness

C200M

BP1

UltraMap-200B

CSW1

Moov에 등재하고 즉시 완벽한 구매자를 찾으십시오.

모든 KLA / MICROSENSE Thin Film / Film Thickness