설명
The FLX-2320 is a thin film stress machine. A laser scanner is used to measure the changes in the radius of curvature of the substrate caused by the deposition of a thin film on the wafer. This is accomplished by first measuring the wafer curvature before the film is deposited and then re-measuring the curvature after the film is deposited. A well-known mathematical relation is then used to calculate the stress of the thin film.환경 설정
환경 설정 없음OEM 모델 설명
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KLA
FLX 2320A
검증됨
카테고리
Thin Film / Film Thickness
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
115322
웨이퍼 사이즈:
알 수 없음
빈티지:
1993
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA
FLX 2320A
카테고리
Thin Film / Film Thickness
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
115322
웨이퍼 사이즈:
알 수 없음
빈티지:
1993
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
The FLX-2320 is a thin film stress machine. A laser scanner is used to measure the changes in the radius of curvature of the substrate caused by the deposition of a thin film on the wafer. This is accomplished by first measuring the wafer curvature before the film is deposited and then re-measuring the curvature after the film is deposited. A well-known mathematical relation is then used to calculate the stress of the thin film.환경 설정
환경 설정 없음OEM 모델 설명
미제공문서
문서 없음