설명
Dimensions / Weight (approx. values) 1066 / 745 / 1380 350 kg Included: Pump: Pfeifer MVP 070-3 (defective)환경 설정
Audit to verify The AWB has the versatility to perform aligned Anodic, Eutectic, Direct (High & Low Temperature) Glass frit, Adhesive, Solder & Thermo-compression wafer bonding. Alignment & bonding in one machine - Wafer size 8" - 8" standard IR platens for forces up to 15kN - IR and vis alignment - Twin Microscope ? camera system with through the-lens illumination. Two CCD cameras and side-by side display of images. Including IR capability. - In-situ alignment up to 1 micron accuracy - 10-6mbar Vacuum to 2bar process gas - forced nitrogen cooling - Voltage up to 2.5kV - Temperature up to 560° C - Semi-automatic PC control & data acquisitionOEM 모델 설명
Wafer to Wafer Bonding - Fully auto-process, with manual wafer loading문서
문서 없음
카테고리
Wafer Bonders
마지막 검증일: 21일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
146031
웨이퍼 사이즈:
8"/200mm
빈티지:
2002
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MICROENGINEERING LTD (AML)
AWB-08
카테고리
Wafer Bonders
마지막 검증일: 21일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
146031
웨이퍼 사이즈:
8"/200mm
빈티지:
2002
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Dimensions / Weight (approx. values) 1066 / 745 / 1380 350 kg Included: Pump: Pfeifer MVP 070-3 (defective)환경 설정
Audit to verify The AWB has the versatility to perform aligned Anodic, Eutectic, Direct (High & Low Temperature) Glass frit, Adhesive, Solder & Thermo-compression wafer bonding. Alignment & bonding in one machine - Wafer size 8" - 8" standard IR platens for forces up to 15kN - IR and vis alignment - Twin Microscope ? camera system with through the-lens illumination. Two CCD cameras and side-by side display of images. Including IR capability. - In-situ alignment up to 1 micron accuracy - 10-6mbar Vacuum to 2bar process gas - forced nitrogen cooling - Voltage up to 2.5kV - Temperature up to 560° C - Semi-automatic PC control & data acquisitionOEM 모델 설명
Wafer to Wafer Bonding - Fully auto-process, with manual wafer loading문서
문서 없음