설명
• Tooling for 6" and 8” substrates inclusive Bond Chuck and Pressure Insert • Capable of fusion compression bonding • Capable of thermal compression bonding • Capable of anodic bonding • Capable of polymer bonding • Ideal for R&D and pilot production applications • High-vacuum capable bond chamber • Auto opening of bond tool cover • Windows based control software and operation interface • Wafer size: up to 150mm capable • Max Bond Force: 10 kN • Top side heater: 550°C max. in 1°C steps • Bottom side heater: 550°C max. in 1°C steps • Temperature uniformity: ± 1,5 % • Turbo pump and controller • Roughing pump • Load/unload tool • System computer, monitor, and keyboard • Fully automated processing with manual loading and unloading coupled with external cooling stations • Capable of bonding 6 or 8 inch wafers using different bonding mechanisms under inert atmosphere • Turbomolecular pumping system & PC-based control • Programmable recipe editing & automatic data logging • Chamber vacuum: Pumping down to 1E-3 mbar within 30mins • Electrical voltage: Up to max. of 2kV • Bonding stack thickness: Up to 2.5mm환경 설정
환경 설정 없음OEM 모델 설명
Wafer Bonder문서
문서 없음
EVGroup (EVG)
EVG520
검증됨
카테고리
Wafer Bonders
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
105029
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
EVGroup (EVG)
EVG520
카테고리
Wafer Bonders
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
105029
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
• Tooling for 6" and 8” substrates inclusive Bond Chuck and Pressure Insert • Capable of fusion compression bonding • Capable of thermal compression bonding • Capable of anodic bonding • Capable of polymer bonding • Ideal for R&D and pilot production applications • High-vacuum capable bond chamber • Auto opening of bond tool cover • Windows based control software and operation interface • Wafer size: up to 150mm capable • Max Bond Force: 10 kN • Top side heater: 550°C max. in 1°C steps • Bottom side heater: 550°C max. in 1°C steps • Temperature uniformity: ± 1,5 % • Turbo pump and controller • Roughing pump • Load/unload tool • System computer, monitor, and keyboard • Fully automated processing with manual loading and unloading coupled with external cooling stations • Capable of bonding 6 or 8 inch wafers using different bonding mechanisms under inert atmosphere • Turbomolecular pumping system & PC-based control • Programmable recipe editing & automatic data logging • Chamber vacuum: Pumping down to 1E-3 mbar within 30mins • Electrical voltage: Up to max. of 2kV • Bonding stack thickness: Up to 2.5mm환경 설정
환경 설정 없음OEM 모델 설명
Wafer Bonder문서
문서 없음