설명
Condition: Complete / Working Status: Installed / Running환경 설정
EVG 850LT Bonder Configured: 200mm Process: Fusion Bond Vacuum: 0.1Torr Temp range: Ambient Aligner: Wafer Edge Aligner Robot type: Genmark (1) Plamsa Chamber (1) Clean/Rinse module IR Module: NoOEM 모델 설명
Automated production bonding system for a wide range of fusion/molecular wafer bonding applications Wafer bonding is one key enabling technology for the SOI wafer fabrication process as well as for wafer-level 3D integration and advanced packaging. With the EVG850 LT automated production bonding system for mechanically aligned SOI and direct wafer bonding with LowTemp™ plasma activation, all essential steps for fusion bonding – from cleaning, plasma activation and alignment to pre-bonding and IR-inspection – are combined. Thus, the field-proven, industry-standard EVG850 LT assures a high-throughput, high-yield production process for void-free SOI wafers up to 300 mm sizes. Wafer Bonder문서
문서 없음
EVGroup (EVG)
EVG850 LT
검증됨
카테고리
Wafer Bonders
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
113644
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG850 LT
카테고리
Wafer Bonders
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
113644
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Condition: Complete / Working Status: Installed / Running환경 설정
EVG 850LT Bonder Configured: 200mm Process: Fusion Bond Vacuum: 0.1Torr Temp range: Ambient Aligner: Wafer Edge Aligner Robot type: Genmark (1) Plamsa Chamber (1) Clean/Rinse module IR Module: NoOEM 모델 설명
Automated production bonding system for a wide range of fusion/molecular wafer bonding applications Wafer bonding is one key enabling technology for the SOI wafer fabrication process as well as for wafer-level 3D integration and advanced packaging. With the EVG850 LT automated production bonding system for mechanically aligned SOI and direct wafer bonding with LowTemp™ plasma activation, all essential steps for fusion bonding – from cleaning, plasma activation and alignment to pre-bonding and IR-inspection – are combined. Thus, the field-proven, industry-standard EVG850 LT assures a high-throughput, high-yield production process for void-free SOI wafers up to 300 mm sizes. Wafer Bonder문서
문서 없음