설명
-Manual wafer load substrate bonder -Capable of fusion compression bonding -Capable of thermal compression bonding -Capable of anodic bonding -Turbo pump and controller -Roughing pump -Load/unload tool -System computer, monitor, and keyboard -PDF Operations Manual for EVG 501 Bonder -Ideal for R&D and pilot production applications -High-vacuum capable bond chamber -Windows based control software and operation interface환경 설정
-Max Bond Force: 7 kN -Top side heater: 550°C max. in 1°C steps -Bottom side heater: 550°C max. in 1°C steps -Temperature uniformity: ± 1,5 %OEM 모델 설명
The EVG501 is a versatile and flexible wafer bonding system, capable of handling substrate sizes ranging from single chips to 150 mm (200 mm with a 200 mm bond chamber). It supports various wafer bonding processes, including anodic, glass frit, solder, eutectic, transient liquid phase, and direct bonding. The system's design allows for easy access to the bond chamber and tooling, enabling quick and straightforward retooling for different wafer sizes and processes. With a conversion time of less than 5 minutes, the EVG501 offers efficient and seamless transitions between different bonding applications, making it an ideal solution for diverse wafer bonding needs.문서
문서 없음
카테고리
Wafer Bonders
마지막 검증일: 6일 전
주요 품목 세부 정보
조건:
Refurbished
작동 상태:
알 수 없음
제품 ID:
132924
웨이퍼 사이즈:
6"/150mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
EVGroup (EVG)
EVG501
카테고리
Wafer Bonders
마지막 검증일: 6일 전
주요 품목 세부 정보
조건:
Refurbished
작동 상태:
알 수 없음
제품 ID:
132924
웨이퍼 사이즈:
6"/150mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
-Manual wafer load substrate bonder -Capable of fusion compression bonding -Capable of thermal compression bonding -Capable of anodic bonding -Turbo pump and controller -Roughing pump -Load/unload tool -System computer, monitor, and keyboard -PDF Operations Manual for EVG 501 Bonder -Ideal for R&D and pilot production applications -High-vacuum capable bond chamber -Windows based control software and operation interface환경 설정
-Max Bond Force: 7 kN -Top side heater: 550°C max. in 1°C steps -Bottom side heater: 550°C max. in 1°C steps -Temperature uniformity: ± 1,5 %OEM 모델 설명
The EVG501 is a versatile and flexible wafer bonding system, capable of handling substrate sizes ranging from single chips to 150 mm (200 mm with a 200 mm bond chamber). It supports various wafer bonding processes, including anodic, glass frit, solder, eutectic, transient liquid phase, and direct bonding. The system's design allows for easy access to the bond chamber and tooling, enabling quick and straightforward retooling for different wafer sizes and processes. With a conversion time of less than 5 minutes, the EVG501 offers efficient and seamless transitions between different bonding applications, making it an ideal solution for diverse wafer bonding needs.문서
문서 없음