메인 콘텐츠로 건너뛰기
6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
Moov logo

6" Fab For Sale from Moov - Click Here to Learn More
Moov Icon

ТВМ-8

카테고리
Wafer Bonders
개요

The EVG TBM-8 is a tool designed for non-destructive, double-sided overlay accuracy measurement. It can measure any substrate material up to 8" and is not reliant on infrared. It’s applicable in micro system technology, sensors, micro optics, hybrid technology, multilayers, and any other technology involving critical double-sided lithography.

활성 등재물

1

서비스

검사, 보험, 감정, 물류

상위 등재물

이런 제품이 있으신가요?
Moov에 등재하고 즉시 완벽한 구매자를 찾으십시오.