설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The EVG TBM-8 is a tool designed for non-destructive, double-sided overlay accuracy measurement. It can measure any substrate material up to 8" and is not reliant on infrared. It’s applicable in micro system technology, sensors, micro optics, hybrid technology, multilayers, and any other technology involving critical double-sided lithography.문서
문서 없음
EVGroup (EVG)
ТВМ-8
검증됨
카테고리
Wafer Bonders
마지막 검증일: 21일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
83923
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
ТВМ-8
카테고리
Wafer Bonders
마지막 검증일: 21일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
83923
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The EVG TBM-8 is a tool designed for non-destructive, double-sided overlay accuracy measurement. It can measure any substrate material up to 8" and is not reliant on infrared. It’s applicable in micro system technology, sensors, micro optics, hybrid technology, multilayers, and any other technology involving critical double-sided lithography.문서
문서 없음