설명
Low Temp. Plasma Activation System for wafer bonding Maker: EVG (EVGroup) Model: EVG 810 LT Type: Manual Type EQP. Size(W*L*H): 1520*1210*1530 (mm) Wafer Size: 50 ~ 200mm Process : Silicon, Glass, GaAs, Etc Applicable for SOI, MEMS, compound semiconductors, and advanced substrates bonding환경 설정
환경 설정 없음OEM 모델 설명
The EVG810 LT LowTemp™ plasma activation system is a single-chamber, stand-alone unit with manual operation. The process chamber allows for ex-situ processes (wafers are activated one by one and bonded outside the plasma activation chamber).문서
문서 없음
EVGroup (EVG)
EVG810 LT
검증됨
카테고리
Wafer Bonders
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Deinstalled
제품 ID:
98353
웨이퍼 사이즈:
2"/50mm, 3"/75mm, 4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
빈티지:
2009
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG810 LT
카테고리
Wafer Bonders
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Deinstalled
제품 ID:
98353
웨이퍼 사이즈:
2"/50mm, 3"/75mm, 4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
빈티지:
2009
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Low Temp. Plasma Activation System for wafer bonding Maker: EVG (EVGroup) Model: EVG 810 LT Type: Manual Type EQP. Size(W*L*H): 1520*1210*1530 (mm) Wafer Size: 50 ~ 200mm Process : Silicon, Glass, GaAs, Etc Applicable for SOI, MEMS, compound semiconductors, and advanced substrates bonding환경 설정
환경 설정 없음OEM 모델 설명
The EVG810 LT LowTemp™ plasma activation system is a single-chamber, stand-alone unit with manual operation. The process chamber allows for ex-situ processes (wafers are activated one by one and bonded outside the plasma activation chamber).문서
문서 없음