We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 더 알아보기
설명
Low Temp. Plasma Activation System for wafer bonding Maker: EVG (EVGroup) Model: EVG 810 LT Type: Manual Type EQP. Size(W*L*H): 1520*1210*1530 (mm) Wafer Size: 50 ~ 200mm Process : Silicon, Glass, GaAs, Etc Applicable for SOI, MEMS, compound semiconductors, and advanced substrates bonding환경 설정
환경 설정 없음OEM 모델 설명
The EVG810 LT LowTemp™ plasma activation system is a single-chamber, stand-alone unit with manual operation. The process chamber allows for ex-situ processes (wafers are activated one by one and bonded outside the plasma activation chamber).문서
문서 없음
카테고리
Wafer Bonders
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Deinstalled
제품 ID:
98353
웨이퍼 사이즈:
2"/50mm, 3"/75mm, 4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
빈티지:
2009
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG810 LT
카테고리
Wafer Bonders
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Deinstalled
제품 ID:
98353
웨이퍼 사이즈:
2"/50mm, 3"/75mm, 4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
빈티지:
2009
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Low Temp. Plasma Activation System for wafer bonding Maker: EVG (EVGroup) Model: EVG 810 LT Type: Manual Type EQP. Size(W*L*H): 1520*1210*1530 (mm) Wafer Size: 50 ~ 200mm Process : Silicon, Glass, GaAs, Etc Applicable for SOI, MEMS, compound semiconductors, and advanced substrates bonding환경 설정
환경 설정 없음OEM 모델 설명
The EVG810 LT LowTemp™ plasma activation system is a single-chamber, stand-alone unit with manual operation. The process chamber allows for ex-situ processes (wafers are activated one by one and bonded outside the plasma activation chamber).문서
문서 없음