메인 콘텐츠로 건너뛰기
6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
Moov logo

6" Fab For Sale from Moov - Click Here to Learn More
Moov Icon
EVGroup (EVG) EVG850 TB
    설명
    Sapphire to GaAs wafer bonding
    환경 설정
    환경 설정 없음
    OEM 모델 설명
    The fully automated temporary bonding system achieves the whole temporary bonding process – starting with temporary adhesive application, baking, alignment and bonding of the device wafer to the carrier wafer – within one automated tool. The equipment layout is modular as with all of EVG’s fully automated tools, meaning it can be throughput-optimized depending on the specific process. The optional inline metrology module allows total process monitoring and parameter optimization with feedback loops. Because of EVG’s open platform, different types of temporary bonding adhesives can be used, such as spin coat thermoplast, thermoset materials, or tapes. Wafer Bonder
    문서

    EVGroup (EVG)

    EVG850 TB

    verified-listing-icon

    검증됨

    카테고리
    Wafer Bonders

    마지막 검증일: 60일 이상 전

    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    82029


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    알 수 없음


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    유사 등재물
    모두 보기
    EVGroup (EVG) EVG850 TB

    EVGroup (EVG)

    EVG850 TB

    Wafer Bonders
    빈티지: 2012조건: 중고
    마지막 검증일60일 이상 전

    EVGroup (EVG)

    EVG850 TB

    verified-listing-icon
    검증됨
    카테고리
    Wafer Bonders
    마지막 검증일: 60일 이상 전
    listing-photo-eadea610f9fd4d3bb5ddff78f7236b19-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    82029


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    알 수 없음


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    설명
    Sapphire to GaAs wafer bonding
    환경 설정
    환경 설정 없음
    OEM 모델 설명
    The fully automated temporary bonding system achieves the whole temporary bonding process – starting with temporary adhesive application, baking, alignment and bonding of the device wafer to the carrier wafer – within one automated tool. The equipment layout is modular as with all of EVG’s fully automated tools, meaning it can be throughput-optimized depending on the specific process. The optional inline metrology module allows total process monitoring and parameter optimization with feedback loops. Because of EVG’s open platform, different types of temporary bonding adhesives can be used, such as spin coat thermoplast, thermoset materials, or tapes. Wafer Bonder
    문서
    유사 등재물
    모두 보기
    EVGroup (EVG) EVG850 TB

    EVGroup (EVG)

    EVG850 TB

    Wafer Bonders빈티지: 2012조건: 중고마지막 검증일:60일 이상 전
    EVGroup (EVG) EVG850 TB

    EVGroup (EVG)

    EVG850 TB

    Wafer Bonders빈티지: 0조건: 중고마지막 검증일:60일 이상 전
    EVGroup (EVG) EVG850 TB

    EVGroup (EVG)

    EVG850 TB

    Wafer Bonders빈티지: 2001조건: 중고마지막 검증일:60일 이상 전