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SUSS MicroTec / KARL SUSS SB8 Gen2
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    환경 설정
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    OEM 모델 설명
    SB6/8 Gen2 SUSS MicroTec provides a semi-automated platform for multiple bonding processes. Handling wafers up to 200mm as well as various shapes and types of substrates the SB6/8 Gen2 presents itself as a flexible tool for various applications and process environments. The SB6/8 Gen2 is suitable for packaging as well structuring meeting the requirements for MEMS, LED, advanced packaging, 2,5D integration, and 3D integration. SB8 Gen2 - from pieces up to 200mm wafers. Wafer Bonder
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    SUSS MicroTec / KARL SUSS

    SB8 Gen2

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    검증됨

    카테고리
    Wafer Bonders

    마지막 검증일: 60일 이상 전

    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    92362


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    알 수 없음


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    유사 등재물
    모두 보기
    SUSS MicroTec / KARL SUSS SB8 Gen2

    SUSS MicroTec / KARL SUSS

    SB8 Gen2

    Wafer Bonders
    빈티지: 0조건: 중고
    마지막 검증일60일 이상 전

    SUSS MicroTec / KARL SUSS

    SB8 Gen2

    verified-listing-icon
    검증됨
    카테고리
    Wafer Bonders
    마지막 검증일: 60일 이상 전
    listing-photo-5f6d896826f44b13b895116d6c185db0-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    92362


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    알 수 없음


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    설명
    설명 없음
    환경 설정
    환경 설정 없음
    OEM 모델 설명
    SB6/8 Gen2 SUSS MicroTec provides a semi-automated platform for multiple bonding processes. Handling wafers up to 200mm as well as various shapes and types of substrates the SB6/8 Gen2 presents itself as a flexible tool for various applications and process environments. The SB6/8 Gen2 is suitable for packaging as well structuring meeting the requirements for MEMS, LED, advanced packaging, 2,5D integration, and 3D integration. SB8 Gen2 - from pieces up to 200mm wafers. Wafer Bonder
    문서

    문서 없음

    유사 등재물
    모두 보기
    SUSS MicroTec / KARL SUSS SB8 Gen2

    SUSS MicroTec / KARL SUSS

    SB8 Gen2

    Wafer Bonders빈티지: 0조건: 중고마지막 검증일:60일 이상 전