설명
Logitech 1WBT2 4" Wafer Substrate Bonding Unit/Bonder ***This unit has 2 of the bonding stations removed but I believe it will still function as a single unit. Each bonding unit costs about $6500.00 from the manufacturer to replace.*** Key Features: Automated process cycle minimizes operator input Excellent wafer to support disc parallelism Touch button control of bonding parameters Bubble free bond 4" (102 mm) wafer capacity Single or multiple wafer capacity (technically this unit is a single unit cause the other 2 stations are removed) Description: Bonding techniques for processing thin and fragile II-VI and III-V semiconductor wafers such as silicon, GaAs and InP require delicate handling procedures. Laboratories bonding such materials need to maintain the highest quality of sample yield and minimize breakage of these expensive materials in wafer preparation process. The Logitech Wafer Substrate Bonding Unit has been designed to meet such stringent requirements. This highly automated machine incorporates both vacuum and pressure bonding facilities. It allows the operator to mount and bond up to three part or whole wafers up to a diameter of 4" (102 mm) prior to further processing. The system produces consistently high standards of wafers to support disc parallelism, irrespective of whether one large wafer or a number of smaller wafers of differing thickness are being mounted and bonded. Touch button control of the process display on the machine's front panel allows all process parameters to be accurately controlled. This includes a programmable bonding temperature and vacuum to produce the required environment for a specific sample type.환경 설정
The Unit's Serial Number Tag Reads: Model Number: 1WBT2 Serial Number: 32-08-99 Power Requirements: 110 V, 60 A, Single Phase, 13 A Specifications: Maximum Support Disc Size: Diameter: 108 mm (4.25") Thickness: 8 mm (0.31") Maximum Capacity: 1* or 3*** wafers Overall Dimensions: 350 mm H x 580 mm D x 960 mm L (13.78" x 22.83" x 37.80") Weight: 57 kg (126 lbs) Power Requirements: 1.44 kW (110 V) Water Supply Requirements: Mains pressure cold water Pressurised Air (Optional): Regulated to 2 bar ±0.2 bar maximum Notes: *: Refers to single station unit ***: Refers to three station unitOEM 모델 설명
미제공문서
문서 없음
LOGITECH
1WBT2
카테고리
Wafer Bonders
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Deinstalled / Uncrated
제품 ID:
127014
웨이퍼 사이즈:
4"/100mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Logitech 1WBT2 4" Wafer Substrate Bonding Unit/Bonder ***This unit has 2 of the bonding stations removed but I believe it will still function as a single unit. Each bonding unit costs about $6500.00 from the manufacturer to replace.*** Key Features: Automated process cycle minimizes operator input Excellent wafer to support disc parallelism Touch button control of bonding parameters Bubble free bond 4" (102 mm) wafer capacity Single or multiple wafer capacity (technically this unit is a single unit cause the other 2 stations are removed) Description: Bonding techniques for processing thin and fragile II-VI and III-V semiconductor wafers such as silicon, GaAs and InP require delicate handling procedures. Laboratories bonding such materials need to maintain the highest quality of sample yield and minimize breakage of these expensive materials in wafer preparation process. The Logitech Wafer Substrate Bonding Unit has been designed to meet such stringent requirements. This highly automated machine incorporates both vacuum and pressure bonding facilities. It allows the operator to mount and bond up to three part or whole wafers up to a diameter of 4" (102 mm) prior to further processing. The system produces consistently high standards of wafers to support disc parallelism, irrespective of whether one large wafer or a number of smaller wafers of differing thickness are being mounted and bonded. Touch button control of the process display on the machine's front panel allows all process parameters to be accurately controlled. This includes a programmable bonding temperature and vacuum to produce the required environment for a specific sample type.환경 설정
The Unit's Serial Number Tag Reads: Model Number: 1WBT2 Serial Number: 32-08-99 Power Requirements: 110 V, 60 A, Single Phase, 13 A Specifications: Maximum Support Disc Size: Diameter: 108 mm (4.25") Thickness: 8 mm (0.31") Maximum Capacity: 1* or 3*** wafers Overall Dimensions: 350 mm H x 580 mm D x 960 mm L (13.78" x 22.83" x 37.80") Weight: 57 kg (126 lbs) Power Requirements: 1.44 kW (110 V) Water Supply Requirements: Mains pressure cold water Pressurised Air (Optional): Regulated to 2 bar ±0.2 bar maximum Notes: *: Refers to single station unit ***: Refers to three station unitOEM 모델 설명
미제공문서
문서 없음