설명
Manual Mounter환경 설정
환경 설정 없음OEM 모델 설명
UH114-8 set the benchmark for control and versatility. For dicing/sawing applications, uniform adhesive plastic film lamination is paramount. The mounters feature an easily adjustable spring-loaded roller assembly, along with film tensioner bars along both the x- and y-axes to assure bubble-free lamination of the film to the wafer and film frame. In addition, both models feature a retractable film cutting system with adjustable cutting pressure to accommodate various tape base materials and thicknesses. Roller pressure is adjusted from the topside of the units for different process requirements and to accommodate various wafer thicknesses. A digital temperature controller assures consistent workstage temperatures for repeatable mounting. Adjustable alignment pins and vacuum cups accommodate almost any type of film frame, including plastic. The workstage height is also adjustable relative to the frame height for different wafer thicknesses.문서
문서 없음
ULTRON SYSTEMS
UH114-8
검증됨
카테고리
Wafer / Film Mounter
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
79508
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ULTRON SYSTEMS
UH114-8
카테고리
Wafer / Film Mounter
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
79508
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Manual Mounter환경 설정
환경 설정 없음OEM 모델 설명
UH114-8 set the benchmark for control and versatility. For dicing/sawing applications, uniform adhesive plastic film lamination is paramount. The mounters feature an easily adjustable spring-loaded roller assembly, along with film tensioner bars along both the x- and y-axes to assure bubble-free lamination of the film to the wafer and film frame. In addition, both models feature a retractable film cutting system with adjustable cutting pressure to accommodate various tape base materials and thicknesses. Roller pressure is adjusted from the topside of the units for different process requirements and to accommodate various wafer thicknesses. A digital temperature controller assures consistent workstage temperatures for repeatable mounting. Adjustable alignment pins and vacuum cups accommodate almost any type of film frame, including plastic. The workstage height is also adjustable relative to the frame height for different wafer thicknesses.문서
문서 없음