설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The W-GM-4200 is an edge grinding machine for wafer manufacturing up to 200 mm in diameter. It is produced by ACCRETECH and has a wide scope of application, high grinding precision, compact design, and is easy to operate. It is suitable for various wafer materials, such as GaAs, SiC, GaN, etc. The machine has a newly developed grinding unit for better rotational precision of the spindle and the profile sharpness.문서
문서 없음
카테고리
Wafer Grinding
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
131745
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ACCRETECH / TOSEI
W-GM-4200
카테고리
Wafer Grinding
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
131745
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The W-GM-4200 is an edge grinding machine for wafer manufacturing up to 200 mm in diameter. It is produced by ACCRETECH and has a wide scope of application, high grinding precision, compact design, and is easy to operate. It is suitable for various wafer materials, such as GaAs, SiC, GaN, etc. The machine has a newly developed grinding unit for better rotational precision of the spindle and the profile sharpness.문서
문서 없음